Taiwan Semiconductor Manufacturing Company (TSMC) is the pioneer and leader of the semiconductor dedicated IC foundry business model. TSMC provides the cutting-edge technology and the best manufacturing efficiency in wafer production.
Hirata x TSMC Partnership Results: In 2013, Ebara CMP EFEM was mass produced in Taiwan. In 2014, we became the designated supplier for mass-producing EFEM at the factory in Longtan.
AU Optronics Corporation (AUO) is equipped with a complete range of product lines which offer a full range of panels from large to small. AUO is the first TFT-LCD manufacturer, which designs, manufactures, research, and develops TFT-LCD, to be successfully listed on the New York Stock Exchange (NYSE). AU joined the green-energy industry in 2008 and has been committed to providing clients with high-efficient solar energy solutions since then.
Hirata x AUO production experience：
2007 L6B Ph3 LDULD mass production
2009 L8A LDULD mass production
2010 L8B CST Station mass production
2015 L8B G1 CST Station mass production
2017 L8B G2 CST Station mass production
INNOLUX is the largest flat panel display company in Taiwan and the 3rd largest in the world. INNOLUX integrated the manufacturing supply chain. Equipped with its panel expertise and innovative business methods of vertical integration, INNOLUX provides its clients with complete solution proposals.
Hirata x INNOLUX Partnership Results: The G8.6 Project took place in 2016 in which we provided support in the mass production of Hirata Robot.
As the leading company in the semiconductor industry, United Microelectronics Corporation (UMC) operates with the latest manufacturing process for wafer production and manufactures wafers for various applications in the IC industry.
Hirata x UMC Partnership Results: Since 2014, Hirata wafer sorter began to be manufactured in Tainan. In 2016, the product began to be mass produced in Xiamen, China.
2016年成功整合VisEra 200mm 晶圓生產製程設備
2019年成功導入VisEra 200mm 晶圓撿片自動化設備
2018年 Hirata Panel EFEM for FOWLP導入。
2019年 Hirata Panel Sorter for FOWLP導入。
2019年 300mm Ring Wafer Coin Stack packing/unpacking System 導入。
2020年 MP Panel EFEM system 導入。